Thick-Film Hybrid Integrated Circuit Market Research Report – Segmentation By Type (Al2O3 Ceramic Substrate, BeO Ceramic Substrate, AIN Substrates, Others); Application (Avionics and Défense, Automotive, Telecoms and Computer Industry, Consumer Electronics, Others); and Region - Size, Share, Growth Analysis | Forecast (2024 – 2030)
Published: 2024 - January
Report Code: IM-14748
Format:
Region: Global
Chapter 1.THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET – Scope & Methodology
1.1. Market Segmentation
1.2. Assumptions
1.3. Research Methodology
1.4. Primary Sources
1.5. Secondary Sources
Chapter 2.THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET – Executive Summary
2.1. Market Size & Forecast – (2023 – 2030) ($M/$Bn)
2.2. Key Trends & Insights
2.3. COVID-19 Impact Analysis
2.3.1. Impact during 2023 - 2030
2.3.2. Impact on Supply – Demand
Chapter 3.THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET – Competition Scenario
3.1. Market Share Analysis
3.2. Product Benchmarking
3.3. Competitive Strategy & Development Scenario
3.4. Competitive Pricing Analysis
3.5. Supplier - Distributor Analysis
Chapter 4.THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET - Entry Scenario
4.1. Case Studies – Start-up/Thriving Companies
4.2. Regulatory Scenario - By Region
4.3 Customer Analysis
4.4. Porter's Five Force Model
4.4.1. Bargaining Power of Suppliers
4.4.2. Bargaining Powers of Customers
4.4.3. Threat of New Entrants
4.4.4. Rivalry among Existing Players
4.4.5. Threat of Substitutes
Chapter 5. THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET- Landscape
5.1. Value Chain Analysis – Key Stakeholders Impact Analysis
5.2. Market Drivers
5.3. Market Restraints/Challenges
5.4. Market Opportunities
Chapter 6.THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET – By Type
6.1. Al2O3 Ceramic Substrate
6.2. BeO Ceramic Substrate
6.3. AIN Substrates
6.4. Other Substrate
Chapter 7.THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET– By Application
7.1. Avionics and Defense
7.2. Automotive
7.3. Telecoms and Computer Industry
7.4. Consumer Electrons
Chapter 8.THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET– By Region
8.1. North America
8.2. Europe
8.3. The Asia Pacific
8.4. Latin America
8.5. The Middle East
8.6. Africa
Chapter 9.THICK-FILM HYBRID INTEGRATED CIRCUIT MARKET– Company Profiles – (Overview, Product Portfolio, Financials, Developments)
9.1. Advance Circuit Technology, Inc.
9.2. Cermetek MicroElectronics, Inc.
9.3. Emtron Hybrids Inc.
9.4. Infineon Technologies AG
9.5. Integrated Technology Lab, Inc.
9.6. InterFET
9.7. Japan Resistor Mfg. Co., Ltd.
9.8. Kolektor Siegert GmbH
9.9. Semtech Corporation
9.10. Technograph Microcircuits Ltd.
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Frequently Asked Questions
The Thick-film Hybrid Integrated Circuit market size will witness more than 7.5 % CAGR from 2023 to 2030.
Key industry players include Advance Circuit Technology, Inc., Cermetek MicroElectronics, Inc., Emtron Hybrids Inc., Infineon Technologies AG, Integrated Technology Lab, Inc., InterFET, Japan Resistor Mfg. Co., Ltd., Kolektor Siegert GmbH, Semtech Corporation, Technograph Microcircuits Ltd. .
The Asia Pacific region held the top regional market position and contributed more than 40% of worldwide revenue.
The TFHIC market is projected to witness significant growth in the coming years due to the increasing demand for high-performance, reliable, and cost-effective electronic devices. The growth in the TFHIC market is driven by the increasing demand for advanced technologies such as the internet of things (IoT), artificial intelligence (AI), and automation in various sectors.
The Segments under the Thick-film Hybrid Integrated Circuit Market by Application are Avionics and defence, Automotive, Telecoms and Computer Industry, Consumer Electrons.
