Chapter 1.         SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET– Scope & Methodology

1.1. Market Segmentation

1.2. Assumptions

1.3. Research Methodology

1.4. Primary Sources

1.5. Secondary Sources

Chapter 2.         SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET – Executive Summary

2.1. Market Size & Forecast – (2023 – 2030) ($M/$Bn)

2.2. Key Trends & Insights

2.3. COVID-19 Impact Analysis

 2.3.1. Impact during 2023 - 2030

  2.3.2. Impact on Supply – Demand

Chapter 3.         SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET – Competition Scenario

3.1. Market Share Analysis

3.2. Product Benchmarking

3.3. Competitive Strategy & Development Scenario

3.4. Competitive Pricing Analysis

3.5. Supplier - Distributor Analysis

Chapter 4.        MOBILE 3D MARKET- Entry Scenario

4.1. Case Studies – Start-up/Thriving Companies

4.2. Regulatory Scenario - By Region

4.3 Customer Analysis

4.4. Porter's Five Force Model

       4.4.1. Bargaining Power of Suppliers

       4.4.2. Bargaining Powers of Customers

       4.4.3. Threat of New Entrants

       4.4.4. Rivalry among Existing Players

       4.4.5. Threat of Substitutes

Chapter 5.        SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET- Landscape

5.1. Value Chain Analysis – Key Stakeholders Impact Analysis

5.2. Market Drivers

5.3. Market Restraints/Challenges

5.4. Market Opportunities

Chapter 6.  SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET – By TYPE

6.1. Encapsulation resins

6.2. Ceramic packages

6.3. Die attach materials

6.4. Thermal interface materials

6.5. Solder balls

6.6. Organic substrates

6.7. Bonding wires

6.8. Leadframes

6.9. Others

Chapter 7.       SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET – By Packaging Technology

7.1. DFN

7.2. DIP

7.3. GA

7.4. QFN

7.5. QFP

7.6. SOP

7.7. Others

Chapter 8.         SEMICONDUCTOR & IC PACKAGING MATERIALS MARKET – By Region