Chapter 1.  Embedded Die Packaging in IC Package Substrate Market  – Scope & Methodology
1.1    Market Segmentation
1.2    Scope, Assumptions & Limitations
1.3    Research Methodology
1.4    Primary Sources
1.5    Secondary Sources 
Chapter 2.  Embedded Die Packaging in IC Package Substrate Market – Executive Summary
2.1    Market Size & Forecast – (2024 – 2030) ($M/$Bn)
2.2    Key Trends & Insights
           2.2.1    Demand Side
           2.2.2    Supply Side
2.3    Attractive Investment Propositions
2.4    COVID-19 Impact Analysis 
Chapter 3.  Embedded Die Packaging in IC Package Substrate Market – Competition Scenario
3.1    Market Share Analysis & Company Benchmarking
3.2    Competitive Strategy & Development Scenario
3.3    Competitive Pricing Analysis
3.4    Supplier-Distributor Analysis
Chapter 4.  Embedded Die Packaging in IC Package Substrate Market - Entry Scenario
4.1    Regulatory Scenario
4.2    Case Studies – Key Start-ups
4.3    Customer Analysis
4.4    PESTLE Analysis
4.5    Porters Five Force Model
           4.5.1    Bargaining Power of Suppliers
           4.5.2    Bargaining Powers of Customers
           4.5.3    Threat of New Entrants
           4.5.4    Rivalry among Existing Players
           4.5.5    Threat of Substitutes 
Chapter 5.  Embedded Die Packaging in IC Package Substrate Market – Landscape
5.1    Value Chain Analysis – Key Stakeholders Impact Analysis
5.2    Market Drivers
5.3    Market Restraints/Challenges
5.4    Market Opportunities
Chapter 6.  Embedded Die Packaging in IC Package Substrate Market –  By End-use Industry
6.1    Introduction/Key Findings   
6.2    Consumer Electronics
6.3    IT & Telecommunication
6.4    Healthcare
6.5    Aerospace & Defense
6.6    Automotive
6.7    Others
6.8         Y-O-Y Growth trend Analysis  By End-use Industry
6.9    Absolute $ Opportunity Analysis By End-use Industry, 2024-2030
 Chapter 7.  Embedded Die Packaging in IC Package Substrate Market – By Application
7.1    Introduction/Key Findings   
7.2    Smartphone & Tablets
7.3    Medical Implants and Wearable Devices
7.4    Industrial Sensing Devices
7.5    Industrial Controlling Devices
7.6    Industrial Metering Devices
7.7    Military Communication & Power Devices 
7.8    Others
7.9    Y-O-Y Growth  trend Analysis  By Application
7.10    Absolute $ Opportunity Analysis  By Application, 2024-2030  
Chapter 8.  Embedded Die Packaging in IC Package Substrate Market , By Geography – Market Size, Forecast, Trends & Insights
8.1    North America
           8.1.1    By Country
                      8.1.1.1    U.S.A.
                      8.1.1.2    Canada
                      8.1.1.3    Mexico
                      8.1.1.4    By End-use Industry
           8.1.2      By Application
           8.1.3    Countries & Segments - Market Attractiveness Analysis
8.2    Europe
           8.2.1    By Country
                      8.2.1.1    U.K
                      8.2.1.2    Germany
                      8.2.1.3    France
                      8.2.1.4    Italy
                      8.2.1.5    Spain
                      8.2.1.6    Rest of Europe
           8.2.2      By End-use Industry 
           8.2.3       By Application
           8.2.4    Countries & Segments - Market Attractiveness Analysis
8.3    Asia Pacific
           8.3.1    By Country
                      8.3.1.1    China
                      8.3.1.2    Japan
                      8.3.1.3    South Korea
                      8.3.1.4    India      
                      8.3.1.5    Australia & New Zealand
                      8.3.1.6    Rest of Asia-Pacific
           8.3.2      By End-use Industry
           8.3.3       By Application
           8.3.4    Countries & Segments - Market Attractiveness Analysis
8.4    South America
           8.4.1    By Country
                      8.4.1.1    Brazil
                      8.4.1.2    Argentina
                      8.4.1.3    Colombia
                      8.4.1.4    Chile
                      8.4.1.5    Rest of South America
           8.4.2      By End-use Industry
           8.4.3       By Application
           8.4.4    Countries & Segments - Market Attractiveness Analysis
8.5    Middle East & Africa
           8.5.1    By Country
                      8.5.1.1    United Arab Emirates (UAE)
                      8.5.1.2    Saudi Arabia
                      8.5.1.3    Qatar
                      8.5.1.4    Israel
                      8.5.1.5    South Africa
                      8.5.1.6    Nigeria
                      8.5.1.7    Kenya
                      8.5.1.8    Egypt
                      8.5.1.9    Rest of MEA
           8.5.2      By End-use Industry
           8.5.3       By Application
           8.5.4    Countries & Segments - Market Attractiveness Analysis 
Chapter 9.  Embedded Die Packaging in IC Package Substrate Market – Company Profiles – (Overview,    Embedded Die Packaging in IC Package Substrate Market  Portfolio, Financials, Strategies & Developments)
9.1    ASE Group,
9.2    AT&S,
9.3    Fujitsu Limited,
9.4    General Electric,
9.5    Infineon Technologies AG,
9.6    Microsemi Corporation,
9.7    STMicroelectronics,
9.8    TDK Corporation,
9.9    Texas Instruments Incorporation
9.10    Toshiba Corporation